The robotic dispensing system is a sealing, bonding and potting/encapsulation solution for electrical enclosures, automotive parts, air filters, luminaries, drum lids, electronic components and many more. The standard configuration includes a low pressure mixing and dosing unit, cartesian or 6 DOF robot, a dispensing table and a temperature conditioning unit. There are wide range of options and automation solutions available to configure the ideal solution for your applications.
One or two component, moisture or heat cured polyurethane and silicon materials are used in cured in place dispensing systems. Curing happens before or after the assembly of work parts based on the application requirement and selected material. Strip die cut and moulded gaskets are replaced by cured in place seals and gaskets because of many advantages such as better compression and recovery of physical properties, uniform structure at the start-stop point, remarkable reduction in labour cost with its suitability to be used in automation concepts.
Electronic components, connections or terminations are partially or completely covered in potting/encapsulation processes with one or two component resins such as epoxy, silicone or polyurethane for protection against moisture, dirt, oil or chemicals in the environment, shock and vibration. Potting/encapsulation is performed at atmospheric pressure or under vacuum pressure for void-free production.
Adhesive bonding is an alternative technique in manufacturing processes to reduce or eliminate the requirement for conventional joining methods such as welding, bolting and riveting. A layer of adhesive material is applied to bond substrates of different parts. It simplifies manufacturing operations, reduces cost and increases safety and efficiency.